3D Microelectronic Packaging

From Fundamentals to Applications

Buch | Softcover

IX, 463 Seiten

2018 | 1. Softcover reprint of the original 1st ed. 2017
Springer International Publishing (Verlag)
978-3-319-83086-5 (ISBN)

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV.- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging.- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages .- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging.- Fundamentals of advanced materials and processes in organic substrate technology.- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization.- Processing and Reliability of Solder Interconnections in Stacked Packaging.- Interconnect Quality and Reliability of 3D Packaging.- Fault isolation and failure analysis of 3D packaging.

Erscheinungsdatum	05.03.2022
Reihe/Serie	Springer Series in Advanced Microelectronics
Zusatzinfo	IX, 463 p. 331 illus., 253 illus. in color.
Verlagsort	Cham
Sprache	englisch
Maße	155 x 235 mm
Gewicht	724 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Themenwelt	Technik ► Maschinenbau
Schlagworte	3D microelectronic packages • Advanced materials in 3D packages • Failure analysis microelectronic packaging • Heat dissipation • Metallic and polymeric packaging materials • Micro bumps • Quality and Reliability of 3D Packaging • Solder connects in 3D packages • Through-Silicon Via • TSV Processing and Reliability
ISBN-10	3-319-83086-4 / 3319830864
ISBN-13	978-3-319-83086-5 / 9783319830865
Zustand	Neuware