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Perspectives, Science and Technologies for Novel Silicon on Insulator Devices -

Perspectives, Science and Technologies for Novel Silicon on Insulator Devices

Proceedings of the NATO Advanced Research Workshop, Kyiv, Ukraine, 12-15 October, 1998

Peter L. F. Hemment, etc. (Herausgeber)

Buch | Hardcover
368 Seiten
1999
Kluwer Academic Publishers (Verlag)
978-0-7923-6116-9 (ISBN)
CHF 269,55 inkl. MwSt
This volume contains the key papers presented during the International NATO Advanced Research Workshop on Silicon on Insulator device technologies. The authors explore issues including the economic aspects incorporating SOI and related materials into circuits and systems.
This concise volume contains the key papers presented during the International NATO Advanced Research Workshop on Silicon on Insulator device technologies. The authors have moved beyond reporting the current state of the technology to explore wider issues, from the economic aspects incorporating SOI and related materials into circuits and systems to consideration of low temperature electronics, quantum devices and MEMS.

Committee Members. Invited Speakers. Workshop Photographs. Section 1: Innovations in Materials Technologies. 1.1. SMART-CUT TM Technology: Basic Mechanisms and Applications; M. Bruel. 1.2. Polish Stop Technology for Silicon on Silicide on Insulator Structures; H.S. Gamble. 1.3. Homoepitaxy on Porous Silicon with a Buries Oxide Layer; Full-Wafer Scale SOI; S.I. Romanov, et al. 1.4. Structural and Electrical Properties of Silicon on Isolator Structures Manufactured on FZ- and CZ-Silicon by SMART-CUT Technology; V.P. Popov, et al. 1.5. Development of Linear Sequential Lateral Solidification Technique to Fabricate Quasi-Single-Crystal Super-Thin Si Films for High-Performance Thin Film Transistor Devices; A.B. Limanov, et al. Section 2: Economics and Innovation Applications. 2.1. Low Temperature Polysilicon Technology: A Low Cost SOI Technology?; F. Plais, et al. 2.2. A Novel Low Cost Process for the Production of Semiconductor Polycrystalline Silicon from Recycled Industrial Waste; B.N. Mukashev, et al. 2.3. Tetrahedrally Bonded Amorphous Carbon for Electronic Applications; W.I. Milne. 2.4. Diamond Based Silicon-on-Insulator Materials and Devices; S. Bengtsson, M. Bergh. 2.5. Low-Temperature Processing of Crystalline Si Films on Glass for Electronic Applications; R.B. Bergmann, et al. 2.6. b-SiC on SiO2 Formed by Ion Implantation and Bonding for Micromechanics Applications; C. Serre, et al. (Part contents).

Erscheint lt. Verlag 31.12.1999
Reihe/Serie NATO Science Partnership Subseries 3: High Technology ; v. 73
Zusatzinfo Illustrations
Sprache englisch
Einbandart gebunden
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 0-7923-6116-4 / 0792361164
ISBN-13 978-0-7923-6116-9 / 9780792361169
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