Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon
William Andrew Publishing (Verlag)
978-0-8155-1442-8 (ISBN)
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The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.
This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Krishna Seshan was an Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.
Recent Changes in the Semiconductor Industry. 1 Deposition Technologies and Applications: Introduction and Overview. 2 Silicon Epitaxy by Chemical Vapor Deposition. 3 Chemical Vapor Deposition of Silicon Dioxide Films. 4 Metal Organic Chemical Vapor Deposition: Technology and Equipment. 5 Feature Scale Modeling. 6 The Role of Metrology and Inspection In Semiconductor Processing. 7 Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing. 8 Sputtering and Sputter Deposition. 9 Laser and Electron Beam Assisted Processing. 10 Molecular Beam Epitaxy: Equipment and Practice. 11 Ion Beam Deposition. 12 Chemical Mechanical Polishing. 13 Organic Dielectrics in Multilevel Metalization of Integrated Circuits. 14 Performance, Processing, and Lithography Trends. Index
| Erscheint lt. Verlag | 1.2.2002 |
|---|---|
| Verlagsort | Norwich |
| Sprache | englisch |
| Maße | 152 x 229 mm |
| Gewicht | 1156 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-8155-1442-5 / 0815514425 |
| ISBN-13 | 978-0-8155-1442-8 / 9780815514428 |
| Zustand | Neuware |
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