Electronic Packaging Materials Science IX: Volume 445

Steven K. Groothuis, Paul S. Ho, Kenzo Ishida, Tien Wu (Herausgeber)

Buch | Hardcover

322 Seiten

1997
Materials Research Society (Verlag)
978-1-55899-349-5 (ISBN)

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Erscheint lt. Verlag	20.10.1997
Reihe/Serie	MRS Proceedings
Zusatzinfo	Worked examples or Exercises
Sprache	englisch
Gewicht	614 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Themenwelt	Technik ► Maschinenbau
ISBN-10	1-55899-349-5 / 1558993495
ISBN-13	978-1-55899-349-5 / 9781558993495
Zustand	Neuware