MEMS/MOEM Packaging
McGraw-Hill Professional (Verlag)
978-0-07-145556-5 (ISBN)
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While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Ken Gilleo, Ph.D., General Technologist for Cookson Electronics, is a widely respected expert on microelectronics packaging. The author of Handbook of Flexible Circuitry and Polymer Thick Film, as well as over 260 professional journal articles on packaging, circuitry, and materials, he holds 35 U.S. patents and currently serves on the board of directors of the SMTA (Surface Mount Technology Association).
PREFACEChapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging1.1: The Package as the Vital Bridge1.2: Packaging Challenges1.3: Multiple Functions1.4: Package Types1.5: Reliability and Qualification1.6: SummaryChapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices2.1: Definitions and Classifications2.2: Basic Principles2.3: Sensing2.4: MEMS Sensor Principles2.5: Motion Actuation2.6: MEMS "Engines"2.7: CAD Structure Library; Building Blocks2.8: MEMS Devices2.9: Optical-MEMS; MOEMS2.10: Intelligent MEMS2.11: MEMS Applications2.12: MOEMS Devices -- MEMS Plus Light2.13: SummaryChapter 3: MEMS and MOEMS Packaging Challenges and Strategies3.1: Product-Specific Character of MEMS Packaging3.2: MEMS General Packaging Requirements3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual3.4: Cost versus Performance Tradeoffs3.5: Emergence of Low-Cost Near-Hermetic Packaging3.6: Manufacturing Process Comparisons3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements3.8: Packages for Materials Handling3.9: NHP Beyond MEMSChapter 4: MEMS Packaging Processes4.1: Release Step4.2: Singulation: Sawing and Protection4.3: Capping Approaches4.4: Die Attach4.5: Wire Bonding4.6: Flip Chip Methods4.7: Tape Automated Bonding (TAB)4.8: Selective Underfill and Encapsulation4.9: Lid Sealing4.10: Antistiction Processes4.11: In-Process Handling4.12: Applying In-Package Additives4.13: Equipment4.14: Testing4.15: Reliability4.16: Selecting the Right MEMS/MOEMS Package and Materials4.17: Conclusions and SummaryChapter 5: MEMS Packaging Materials5.1: The Process Determines the Materials5.2: Joining Materials5.3: Assembly Issues and Material Solutions5.4: In-Package Additives5.5: ConclusionsChapter 6: From MEMS and MOEMS to Nano Technology6.1: Definitions are Important6.2: Combining Nano and MEMS6.3: Packaging Nano6.4: Summary, Conclusions and the FutureBibliographyIndex
| Erscheint lt. Verlag | 16.9.2005 |
|---|---|
| Sprache | englisch |
| Maße | 158 x 236 mm |
| Gewicht | 474 g |
| Themenwelt | Naturwissenschaften |
| Technik ► Elektrotechnik / Energietechnik | |
| Technik ► Maschinenbau | |
| ISBN-10 | 0-07-145556-6 / 0071455566 |
| ISBN-13 | 978-0-07-145556-5 / 9780071455565 |
| Zustand | Neuware |
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