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Heat Transfer Enhancement in Plate and Fin Extended Surfaces

Buch | Hardcover
V, 125 Seiten
2019 | 1st ed. 2020
Springer International Publishing (Verlag)
978-3-030-20735-9 (ISBN)
CHF 74,85 inkl. MwSt
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This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.

Sujoy Kumar Saha is a Professor in the Mechanical Engineering Department of the Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India.

Madhu Sruthi Emani is a doctoral candidate working under the supervision of Dr. Sujoy Kumar Saha, at Indian Institute of Engineering Science and Technology, Shibpur, Howrah, India. She is working in the area of Heat Transfer Enhancement for her PhD thesis.

Anand Kumar Bharti is a doctoral candidate working under the supervision of Dr. Sujoy Kumar Saha, at Indian Institute of Engineering Science and Technology, Shibpur, Howrah, India. He is working in the area of Heat Transfer Enhancement for his PhD thesis.

Hrishiraj Ranjan is a doctoral candidate working under the supervision of Dr. Sujoy Kumar Saha, at Indian Institute of Engineering Science and Technology, Shibpur, Howrah, India. He is working in the area of Heat Transfer Enhancement for his PhD thesis.

Chapter 1. Introduction.- Chapter 2. Offset-Strip Fins.- Chapter 3. Louver Fins and Convex Louver Fins.- Chapter 4. Vortex Generators.- Chapter 5. Wavy Fin, 3D-Corrugated Fin, Perforated Fin, Pin Fin, Wire Mesh, Metal Foam Fin, Packings, Numerical Simulation.- Chapter 6. Conclusions.

Erscheint lt. Verlag 1.8.2019
Reihe/Serie SpringerBriefs in Applied Sciences and Technology
SpringerBriefs in Thermal Engineering and Applied Science
Zusatzinfo V, 125 p.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Themenwelt Mathematik / Informatik Mathematik Wahrscheinlichkeit / Kombinatorik
Naturwissenschaften Physik / Astronomie Thermodynamik
Technik Maschinenbau
Schlagworte Heat Exchangers • Heat Transfer Enhancement Techniques • Offset-Strip Fin • Plate and Fin Extended Surfaces • thermal management
ISBN-10 3-030-20735-8 / 3030207358
ISBN-13 978-3-030-20735-9 / 9783030207359
Zustand Neuware
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