Thermal and Power Management of Integrated Circuits
Seiten
2010
|
Softcover reprint of hardcover 1st ed. 2006
Springer-Verlag New York Inc.
978-1-4419-3832-9 (ISBN)
Springer-Verlag New York Inc.
978-1-4419-3832-9 (ISBN)
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Performance and reliability of integrated circuits are strong functions of the junction temperature.
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.
This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.
This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Power, Junction Temperature, and Reliability.- Burn-in as a Reliability Screening Test.- Thermal and Electrothermal Modeling.- Thermal Runaway and Thermal Management.- Low Temperature CMOS Operation.
| Erscheint lt. Verlag | 29.11.2010 |
|---|---|
| Reihe/Serie | Series on Integrated Circuits and Systems |
| Zusatzinfo | X, 182 p. |
| Verlagsort | New York, NY |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Informatik ► Weitere Themen ► CAD-Programme |
| Technik ► Elektrotechnik / Energietechnik | |
| ISBN-10 | 1-4419-3832-X / 144193832X |
| ISBN-13 | 978-1-4419-3832-9 / 9781441938329 |
| Zustand | Neuware |
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